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Sub-nanometer finishing of polycrystalline tin by inductively coupled plasma-assisted cutting
《机械工程前沿(英文)》 2023年 第18卷 第3期 doi: 10.1007/s11465-023-0751-5
关键词: plasma-assisted cutting polycrystalline tin single-point diamond turning surface roughness
Recent advancements in optical microstructure fabrication through glass molding process
Tianfeng ZHOU,Xiaohua LIU,Zhiqiang LIANG,Yang LIU,Jiaqing XIE,Xibin WANG
《机械工程前沿(英文)》 2017年 第12卷 第1期 页码 46-65 doi: 10.1007/s11465-017-0425-2
Optical microstructures are increasingly applied in several fields, such as optical systems, precision measurement, and microfluid chips. Microstructures include microgrooves, microprisms, and microlenses. This paper presents an overview of optical microstructure fabrication through glass molding and highlights the applications of optical microstructures in mold fabrication and glass molding. The glass-mold interface friction and adhesion are also discussed. Moreover, the latest advancements in glass molding technologies are detailed, including new mold materials and their fabrication methods, viscoelastic constitutive modeling of glass, and microstructure molding process, as well as ultrasonic vibration-assisted molding technology.
关键词: optical microstructure microgroove microlens glass molding process single-point diamond cutting
Molecular dynamics modeling of a single diamond abrasive grain in grinding
Angelos P. MARKOPOULOS,Ioannis K. SAVVOPOULOS,Nikolaos E. KARKALOS,Dimitrios E. MANOLAKOS
《机械工程前沿(英文)》 2015年 第10卷 第2期 页码 168-175 doi: 10.1007/s11465-015-0337-y
In this paper the nano-metric simulation of grinding of copper with diamond abrasive grains, using the molecular dynamics (MD) method, is considered. An MD model of nano-scale grinding, where a single diamond abrasive grain performs cutting of a copper workpiece, is presented. The Morse potential function is used to simulate the interactions between the atoms involved in the procedure. In the proposed model, the abrasive grain follows a curved path with decreasing depth of cut within the workpiece to simulate the actual material removal process. Three different initial depths of cut, namely 4 ?, 8 ? and 12 ?, are tested, and the influence of the depth of cut on chip formation, cutting forces and workpiece temperatures are thoroughly investigated. The simulation results indicate that with the increase of the initial depth of cut, average cutting forces also increase and therefore the temperatures on the machined surface and within the workpiece increase as well. Furthermore, the effects of the different values of the simulation variables on the chip formation mechanism are studied and discussed. With the appropriate modifications, the proposed model can be used for the simulation of various nano-machining processes and operations, in which continuum mechanics cannot be applied or experimental techniques are subjected to limitations.
关键词: molecular dynamics abrasive process chip formation cutting force temperature
Fundamental frequency and testing mode of complicated elastic clamped-plate vibration
QI Hongyuan, GUAN Yiduo
《机械工程前沿(英文)》 2008年 第3卷 第4期 页码 360-364 doi: 10.1007/s11465-008-0084-4
关键词: multi-point excitation rectangle-plate single-point processing technology trigonometric interpolation
Crystallographic orientation effect on cutting-based single atomic layer removal
Wenkun XIE, Fengzhou FANG
《机械工程前沿(英文)》 2020年 第15卷 第4期 页码 631-644 doi: 10.1007/s11465-020-0599-x
关键词: ACSM single atomic layer removal mechanism crystallographic orientation effect mechanical cutting Manufacturing III
刘广志
《中国工程科学》 2000年 第2卷 第5期 页码 31-33
论述了人造金刚石的发展历程及其在我国的迅猛发展,目前我国的人造金刚石产量已居世界首位。进入20世纪末,人造金刚石新品种不断涌现,CVD、卡邦、世界首颗超厘米级C60单晶也研制成功。
Alireza ARABHA NAJAFABADI, Farhad DANESHJOO, Hamid Reza AHMADI
《结构与土木工程前沿(英文)》 2020年 第14卷 第3期 页码 722-730 doi: 10.1007/s11709-020-0624-5
关键词: damage detection strain energy influence line complex bridges rotation displacement
Yanlin HAO, Yaobin TIAN, Jianxu WU, Yezhuo LI, Yan-An YAO
《机械工程前沿(英文)》 2020年 第15卷 第3期 页码 365-373 doi: 10.1007/s11465-020-0585-3
关键词: rolling locomotion expandable mechanism mechanism design zero moment point (ZMP) analysis
Recognition of diamond grains on surface of fine diamond grinding wheel
HUO Fengwei, JIN Zhuji, KANG Renke, GUO Dongming, YANG Chun
《机械工程前沿(英文)》 2008年 第3卷 第3期 页码 325-331 doi: 10.1007/s11465-008-0071-9
关键词: topography frequency disturbance filtering analysis wavelength
Ultra-precision ductile grinding of BK7 using super abrasive diamond wheel
ZHAO Qingliang, Brinksmeier Ekkard, Riemer Oltmann, Rickens Kai
《机械工程前沿(英文)》 2007年 第2卷 第3期 页码 350-355 doi: 10.1007/s11465-007-0061-3
关键词: ELID peripheral electrolytic in-process nickel-electroplated monolayer measurement
Tianfeng ZHOU, Ying WANG, Benshuai RUAN, Zhiqiang LIANG, Xibin WANG
《机械工程前沿(英文)》 2020年 第15卷 第1期 页码 81-88 doi: 10.1007/s11465-019-0561-y
关键词: tool friction minimum cutting thickness finite element method tool edge radius micro cutting
A review on ductile mode cutting of brittle materials
Elijah Kwabena ANTWI, Kui LIU, Hao WANG
《机械工程前沿(英文)》 2018年 第13卷 第2期 页码 251-263 doi: 10.1007/s11465-018-0504-z
Brittle materials have been widely employed for industrial applications due to their excellent mecha-nical, optical, physical and chemical properties. But obtaining smooth and damage-free surface on brittle materials by traditional machining methods like grinding, lapping and polishing is very costly and extremely time consuming. Ductile mode cutting is a very promising way to achieve high quality and crack-free surfaces of brittle materials. Thus the study of ductile mode cutting of brittle materials has been attracting more and more efforts. This paper provides an overview of ductile mode cutting of brittle materials including ductile nature and plasticity of brittle materials, cutting mechanism, cutting characteristics, molecular dynamic simulation, critical undeformed chip thickness, brittle-ductile transition, subsurface damage, as well as a detailed discussion of ductile mode cutting enhancement. It is believed that ductile mode cutting of brittle materials could be achieved when both crack-free and no subsurface damage are obtained simultaneously.
关键词: ductile mode cutting brittle materials critical undeformed chip thickness brittle-ductile transition subsurface damage molecular dynamic simulation
Cutting performance of surgical electrodes by constructing bionic microstriped structures
《机械工程前沿(英文)》 2023年 第18卷 第1期 doi: 10.1007/s11465-022-0728-9
关键词: surgical electrodes tissue adhesion thermal injury bionic structures cutting performance medical tools
Edge preparation methods for cutting tools: a review
《机械工程前沿(英文)》 2023年 第18卷 第4期 doi: 10.1007/s11465-023-0766-y
关键词: edge preparation method preparation principle cutting edge geometry edge characterization tool performance
蛇绿岩型金刚石——探索深部碳循环的新窗口 Review
连东洋, 杨经绥
《工程(英文)》 2019年 第5卷 第3期 页码 406-420 doi: 10.1016/j.eng.2019.02.006
近些年来,在全球不同地区的一些蛇绿岩地幔橄榄岩和铬铁矿中发现了微粒金刚石和其他异常矿物,包括呈斯石英假象的柯石英、碳化硅、青松矿、自然元素矿物、金属合金以及一些壳源矿物(如锆石、石英、角闪石和金红石)。西藏罗布莎铬铁矿中的柯石英和蓝晶石呈针柱状集合体交生在一起,产在钛铁合金矿物的边部,这些柯石英集合体可能代表了更高压相的斯石英发生退变后形成的假象矿物。蓝晶石、柯石英、青松矿包裹体(一种立方晶系的氮化硼)以及TiO2 II(金红石的高压相矿物)等矿物的发现指示铬铁矿形成的温压条件可能达到10~15 GPa、约1300 ℃,深度达大于380 km 的地幔转换带(mantle transition zone,MTZ)深度。碳化硅、自然元素矿物以及金属合金矿物的产出指示了一个超还原的地质环境。与金伯利岩、变质岩和陨石中的金刚石相比,蛇绿岩中的金刚石具有较轻的碳同位素组成以及不同类型的矿物包裹体,指示其碳物质可能源于地表的有机碳,经历了俯冲板片在深部的再循环作用。金刚石在蛇绿岩地幔橄榄岩和铬铁矿中的普遍存在,表明大洋地幔可能是一个重要的碳储库。蛇绿岩型金刚石的发现证明了浅部碳可以俯冲至深部地幔。蛇绿岩型金刚石为研究地球的深部碳循环提供了新窗口。
标题 作者 时间 类型 操作
Recent advancements in optical microstructure fabrication through glass molding process
Tianfeng ZHOU,Xiaohua LIU,Zhiqiang LIANG,Yang LIU,Jiaqing XIE,Xibin WANG
期刊论文
Molecular dynamics modeling of a single diamond abrasive grain in grinding
Angelos P. MARKOPOULOS,Ioannis K. SAVVOPOULOS,Nikolaos E. KARKALOS,Dimitrios E. MANOLAKOS
期刊论文
Fundamental frequency and testing mode of complicated elastic clamped-plate vibration
QI Hongyuan, GUAN Yiduo
期刊论文
Crystallographic orientation effect on cutting-based single atomic layer removal
Wenkun XIE, Fengzhou FANG
期刊论文
Multiple damage detection in complex bridges based on strain energy extracted from single point measurement
Alireza ARABHA NAJAFABADI, Farhad DANESHJOO, Hamid Reza AHMADI
期刊论文
Design and locomotion analysis of two kinds of rolling expandable mobile linkages with a single degree
Yanlin HAO, Yaobin TIAN, Jianxu WU, Yezhuo LI, Yan-An YAO
期刊论文
Recognition of diamond grains on surface of fine diamond grinding wheel
HUO Fengwei, JIN Zhuji, KANG Renke, GUO Dongming, YANG Chun
期刊论文
Ultra-precision ductile grinding of BK7 using super abrasive diamond wheel
ZHAO Qingliang, Brinksmeier Ekkard, Riemer Oltmann, Rickens Kai
期刊论文
Modeling of the minimum cutting thickness in micro cutting with consideration of the friction aroundthe cutting zone
Tianfeng ZHOU, Ying WANG, Benshuai RUAN, Zhiqiang LIANG, Xibin WANG
期刊论文